Power Supply: VDD = 1.2V. VDDQ = 1.2V. VPP = 2.5V. VDDSPD = 2.41V to 2.75V. Functionality and operations comply with the DDR4 SDRAM datasheet. 16 internal banks. Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for. the banks in the same or different bank group accesses are available. Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600. Bi-Directional Differential Data Strobe. 8 bit pre-fetch. Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop). Supports ECC error correction and detection. On-Die Termination (ODT). Temperature sensor with integrated SPD. This product is in compliance with the RoHS directive. Per DRAM Addressability is supported. Internal Vref DQ level generation is available. Write CRC is supported at all speed grades. CA parity (Command/Address Parity) mode is supported. Kingston's KSM32RD8/16HE is a 2G x 72-bit (16GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/. parity, 2Rx8, ECC, memory module, based on eighteen 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers.. Features. Buffered memory type. Registered (buffered). Internal memory. 16 GB. Memory layout (modules x size). 1 x 16 GB. Internal memory type. DDR4. Component for. Server. Memory form factor. 288-pin DIMM. ECC. Yes. CAS latency. 22. Memory data transfer rate. 3200 MT/s. Memory ranking. 2. Memory voltage. 1.2 V. Module configuration. 2048M x 72. Row cycle time. 45.75 ns. Row active time. 32 ns. Programming power voltage (VPP). 2.5 V. SPD profile. Yes. JEDEC standard. Yes. Operational conditions. Operating temperature (T-T). 0 - 85 °C. Storage temperature (T-T). -55 - 100 °C. Technical details. Compliance certificates. RoHS. Weight & dimensions. Width. 133.3 mm. Height. 31.2 mm. leaflet

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